2018 the International Conference on Product and Industrial Engineering (ICPIE 2018)--Ei,Scopus

Organization: ICPIE 2018

Venue: Tibet Hotel Chengdu, China

Location: Chengdu, China

Event Date/Time: Oct 27, 2018 End Date/Time: Oct 29, 2018
Paper Submission Date: Sep 05, 2018
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Description

Publication: All accepted papers after proper registration and presentation, will be published in the Conference Proceedings, and be submitted for Ei Compendex and Scopus index.

Venue

No.Ten, First Section,North Road of People's, Chengdu, China
Chengdu
China
MORE INFO ON THIS VENUE

Organizations

ICPIE 2018

Additional Information

Submission Methods: Full Paper (publication and oral presentation) Abstract (oral presentation only) Electronic Submission System (.pdf)   == Contacts: Ms. Rachel Cao Email: icpie@zhconf.ac.cn Tel: +86-13880104217