IEEE--2020 The 6th Int. Conf. on Mechanical and Electronics Engineering (ICMEE 2020)--Ei,Scopus

Organization: ICMEE 2020

Venue: Osaka Convention Center

Location: Osaka, Japan

Event Date/Time: May 10, 2020 End Date/Time: May 12, 2020
Paper Submission Date: Dec 10, 2019
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Description

Accepted papers can be published in * ICMEE proceedings* and made available through IEEE Xplore. Proceedings will be submitted for inclusion in leading indexing services, including , etc   { History } The 1st ICMEE-Kyoto, Japan | IEEE Xplore ISBN: 978-1-4244-7480-6  The 2nd ICMEE-Hefei, China | AMM ISBN: 978-3-03785-286-6  The 3rd ICMEE-Tianjin, China | AMM ISBN: 978-3-03785-286-6  The 4th ICMEE-Beijing, China | AMM ISBN: 978-3-03785-286-6  The 5th ICMEE-Dalian, China | Matec ISSM: 2261-236X Vol.31 

Venue

5-3-51, Nakanoshima Kita-ku, Osaka 530-0005 JAPAN
Osaka
Japan
MORE INFO ON THIS VENUE

Organizations

ICMEE 2020

Additional Information

{ Submission Method } 1. Send your manuscript directly to conference official email: icmee@outlook.com  2. Submit your paper through easychair system: http://confsys.iconf.org/submission/icmee2020   { Contact } Ms. Serene Lo icmee@outlook.com  +86-028-83208181