2003 IEEE 7th Workshop on Signal Propagation on Interconnects (SPI 2003)

Venue: Hotel Garden Siena

Location: Siena, Italy

Event Date/Time: May 11, 2003 End Date/Time: May 14, 2003
Early Registration Date: Apr 14, 2003
Paper Submission Date: Mar 02, 2003
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Through the nonideal behavior of interconnects, the increase of clock rates and package densities affect the performance of fast digital applications of any kind, ranging from mobile communications to computers and consumer goods. Interconnection issues, therefore, are playing a key role in the advances of technology and their study is an important strategic activity.

The SPI workshop features tutorial courses, keynote speeches on new and current topics, as well as regular papers and poster presentations. The average attendance of the workshop is about 70 people coming in nearly equal parts from industry and university centers, from all over the world.

Tutorial courses and keynote speeches are given by prominent personalities, whereas regular and poster papers, often contributed by leading edge researchers and developers, are selected via a peer review process.

The SPI workshop is coordinated by a steering committee of six outstanding experts from Europe, Canada and USA that guarantee its continuity and its commitment to excellence.

The workshop is jointly sponsored by the IEEE Computer Society, the Test Technology Technical Council and the IEEE Components Packaging and Manufacturing Technology (CPMT) Society. The CPMT (http://www.cpmt.org/) Society is the world reference institution for the technical area of packaging.

The conference proceedings are published as an official IEEE publication.
Selected papers of the workshop are also published in subsequent special issues of the IEEE Transactions on Advanced Packaging.
The workshop language is English.

Main topics of the workshop include, but are not limited to:

Broadband Measurement Techniques and Theory
Coupling Effects on Interconnects
Determination of Characteristic Parameters
Field Theory
Ground Bounce
Guided Waves on Interconnects
Measurement, Modeling, and Simulation of Interconnects inside of Packages
Non-Linear Modeling and Analysis
Propagation Characteristics on Signal and Ground Lines
Radiation and Interference
Simulation Techniques for 2- and 3-dimensional Interconnect Structures
Substrate Influence on Signal Propagation
Interconnects and Testing
Mixed Signal Test
Optical Interconnects: Design and Test


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