Flexible Displays & Electronics 2005 (Flexible Displays)

Venue: Pan Pacific Hotel

Location: San Francisco, California, United States

Event Date/Time: Jun 20, 2005 End Date/Time: Jun 22, 2005
Early Registration Date: Apr 29, 2005
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Description

The conference brings together over 25 distinguished speakers and more than 200 attendees for three full days of analysis, debate and discussion on a wide range of issues facing this rapidly developing industry, including market size and growth potential, technical advances and hurdles, application trends, and production economics. In 2004, 115 companies from 12 countries attended, more international representation than any other event.

The 2005 event will focus special attention on the Asian, European and North American marketplace for flexible displays and applications in which they are beginning to appear… such as e-books, clothing and military applications. Advanced manufacturing techniques, portable power sources, plastic electronics and display backplanes will also be discussed. Conference participants will have ample opportunity to network and discuss the latest business issues with industry experts, key plastic electronics executives and end-users in an open-forum format. A Fashion Show for display of real flexible display applications will be available to all attendees during the evening reception on June 21st. This exclusive event is designed for leading executives, R&D staff, corporate technologists, product managers, end-users and investors to discuss, debate and learn about the latest technical and business opportunities in this potentially explosive field.

Intertech conferences focus on critical industry issues, new business opportunities and emerging technologies. Intertech has organized over 350 conferences in North America, China and Eastern & Western Europe with more than 40,000 attendees since 1975. Related business conferences hosted by Intertech include: Smart Fabrics, Light Emitting Diodes, OLEDs, Phosphor Global Summit, Thin Film Technologies, Compound Semiconductors, Gallium Arsenide, Chemical Mechanical Planarization, Microelectronic Packaging, and Nano-Structured Materials.

Venue