Introduction to Hot Melt Adhesives

Venue: online

Location: online, United States

Event Date/Time: Apr 29, 2008 End Date/Time: Apr 29, 2008
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In Part I of this seminar, conventional non-pressure sensitive hot melt adhesives will be discussed. These are typically used in assembly, packaging, and laminating processes. The advantages and disadvantages of these the various hot melt types will be addressed, and attention will be given on how selective improvements can be made to formulations. Important variables in application and joint design will also be discussed.
(Both Parts I and II will be of interest to the formulator as well as the end-user of these important products.)