INTERNATIONAL CONFERENCE ON EMERGING RESEARCH AND ADVANCES IN MECHANICAL ENGINEERING (ERA 2009)

Venue: Ramanujam Hall

Location: Chennai, Tamil Nadu, India

Event Date/Time: Mar 19, 2009 End Date/Time: Mar 21, 2009
Registration Date: Jan 12, 2009
Early Registration Date: Jan 12, 2009
Abstract Submission Date: Nov 14, 2008
Paper Submission Date: Jan 12, 2009
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Description

In the global competitive customer-centric scenario, the field of mechanical engineering is advancing at a rapid pace and new technologies are emerging in the areas of thermal, automobile, manufacturing, design and development, and manufacturing management. The challenges faced by today’s engineers are forcing them to keep abreast of the emerging trends through continuous research and development. ERA 2009 is intended to provide a common platform to bring together researchers, engineers, scientists, and scholars to exchange and share their experiences, new ideas, and research results about all aspects of Mechanical Engineering, and discuss the practical challenges encountered and the solutions adopted. The conference will include keynote addresses by eminent people in the field of Mechanical Engineering and technical papers presentation.

Venue

Velammal Engineering College
Chennai
Tamil Nadu
India
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Additional Information

CONFERENCE THEMES The conference topics include, but not limited to the following broad areas: A. Thermal Engineering Fluid Mechanics, Heat Transfer, Computational Fluid Dynamics, IC Engine, Automobile Engineering, Combustion and Pollution Control, Thermal Power Plants, Fuel Cell Technology, Thermal Systems, Jet Propulsion, Turbo Machines, Refrigeration & Air conditioning, Energy Conservation, Management &Audit, Renewable & Non Conventional Energy Sources,etc B. Design Engineering FEA/FEM, Tribology and Maintenance, Stress Analysis and Fracture Mechanics, Simulation & Modelling, Vibration and Noise Control, Non-linear Mechanical Systems, Dynamic Systems , Computational Mechanics, Mechatronics, etc C. Manufacturing Engineering CAM/CIM/FMS, Group technology, e-manufacturing, Rapid prototyping, Non-Traditional Machining, Robotics, MEMS, Nanotechnology, Metal Cutting and Tool Design, Knowledge Management in Manufacturing,etc D. Materials & Processing Composite Materials, MMC, FRP, CMC, NanoComposites, Behaviour of Advance Materials, New and Smart Materials, Biomaterials, Fatigue and Fracture, Advance Processing Techniques, etc E. Industrial Engineering and Management TQM/TPM/SPC/FMEF/QFD/QC,ERP/BPR/CAPP, Six Sigma/Taguchi Techniques, Scheduling/Plant Layout/Materials Handling, Time and Work Study, Ergonomics, Supply Chain Management, Reliability and Maintenance Engineering, System Dynamics, Agile / Lean / Concurrent Manufacturing, Operations Research Applications, Nontrational Optimization Techniques (Fuzzy Logic, Artificial Neural Network, GA, SA Techniques etc. SUBMISSION OF ABSTRACT The extended two-page abstract (about 500 words) can be submitted either by email or hard copy must carry sufficient information for fair assessment and should contain the following: • Full title of the paper • Name(s) of author(s), affiliation and full address with telephone numbers and e-mail addresses • Objectives, results and conclusion of the work After provisional acceptance of the abstract, the full paper will be peer-reviewed before final acceptance. The guidelines for preparing a camera-ready paper will be provided along with the provisional acceptance letter. PROCEEDINGS The Proceedings of the Conference will be published in two forms: printed (only abstracts) and CD-ROM (full paper). Both forms of the Proceedings will be available to the Delegates at the time of registration. DEADLINES ---------------------------------------------------------------------------------------------------------------------- 14th November 2008 : Submission of extended Abstract 28th November 2008 : Notification of Acceptance of Abstract 12thJanuary 2008 : Submission of full paper (Camera ready format) 12th January 2008 : Last date for receipt of Registration Fee ------------------------------------------------------------------------------------------------------------------ CONFERENCE FEE The full registration fee includes participation in all sessions, programmes and a copy of abstract, refreshments, lunch, dinner and also a full set of conference proceedings. Category Indian Delegates (in Rs.) Foreign Delegates (US$) Delegates from academic institutions Rs. 1500/- US $400 Delegates from R & D Organisations/Industry Rs. 2000/- US $500 Research Scholars/ Students Rs.1250/- US $300 For each accepted paper to be published in proceedings, at least one of the authors has to register for participation. The registration fees should be paid by Demand Draft in favour of “The Principal, Velammal Engineering College, Chennai”, payable at Chennai.