2009 Product Innovation Summit (IC Summit)

Venue: Shanghai

Location: Shanghai, China

Event Date/Time: Feb 25, 2009 End Date/Time: Feb 25, 2009
Registration Date: Feb 20, 2009
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Description

This summit offers a unique opportunity to learn about all the techniques, tools and
methods of the product innovation process and provides excellent networking opportunities.

Venue

Additional Information

place: Shanghai, China fee: $1,200 for 4 head