| Description |
In the global competitive customer-centric scenario, the field of mechanical engineering is advancing at a rapid pace and new technologies are emerging in the areas of thermal, automobile, manufacturing, design and development, and manufacturing management. The challenges faced by today’s engineers are forcing them to keep abreast of the emerging trends through continuous research and development. ERA 2009 is intended to provide a common platform to bring together researchers, engineers, scientists, and scholars to exchange and share their experiences, new ideas, and research results about all aspects of Mechanical Engineering, and discuss the practical challenges encountered and the solutions adopted. The conference will include keynote addresses by eminent people in the field of Mechanical Engineering and technical papers presentation.
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| Additional Information |
CONFERENCE THEMES
The conference topics include, but not limited to the following broad areas:
A. Thermal Engineering
Fluid Mechanics, Heat Transfer, Computational Fluid Dynamics, IC Engine, Automobile Engineering, Combustion and Pollution Control, Thermal Power Plants, Fuel Cell Technology, Thermal Systems, Jet Propulsion, Turbo Machines, Refrigeration & Air conditioning, Energy Conservation, Management &Audit, Renewable & Non Conventional Energy Sources,etc
B. Design Engineering
FEA/FEM, Tribology and Maintenance, Stress Analysis and Fracture Mechanics, Simulation & Modelling, Vibration and Noise Control, Non-linear Mechanical Systems, Dynamic Systems , Computational Mechanics, Mechatronics, etc
C. Manufacturing Engineering
CAM/CIM/FMS, Group technology, e-manufacturing, Rapid prototyping, Non-Traditional Machining, Robotics, MEMS, Nanotechnology, Metal Cutting and Tool Design, Knowledge Management in Manufacturing,etc
D. Materials & Processing
Composite Materials, MMC, FRP, CMC, NanoComposites, Behaviour of Advance Materials, New and Smart Materials, Biomaterials, Fatigue and Fracture, Advance Processing Techniques, etc
E. Industrial Engineering and Management
TQM/TPM/SPC/FMEF/QFD/QC,ERP/BPR/CAPP, Six Sigma/Taguchi Techniques, Scheduling/Plant Layout/Materials Handling, Time and Work Study, Ergonomics, Supply Chain Management, Reliability and Maintenance Engineering, System Dynamics, Agile / Lean / Concurrent Manufacturing, Operations Research Applications, Nontrational Optimization Techniques (Fuzzy Logic, Artificial Neural Network, GA, SA Techniques etc.
SUBMISSION OF ABSTRACT
The extended two-page abstract (about 500 words) can be submitted either by email or hard copy must carry sufficient information for fair assessment and should contain the following:
• Full title of the paper
• Name(s) of author(s), affiliation and full address with telephone numbers and e-mail addresses
• Objectives, results and conclusion of the work
After provisional acceptance of the abstract, the full paper will be peer-reviewed before final acceptance. The guidelines for preparing a camera-ready paper will be provided along with the provisional acceptance letter.
PROCEEDINGS
The Proceedings of the Conference will be published in two forms: printed (only abstracts) and CD-ROM (full paper). Both forms of the Proceedings will be available to the Delegates at the time of registration.
DEADLINES
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14th November 2008 : Submission of extended Abstract
28th November 2008 : Notification of Acceptance of Abstract
12thJanuary 2008 : Submission of full paper (Camera ready format)
12th January 2008 : Last date for receipt of Registration Fee
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CONFERENCE FEE
The full registration fee includes participation in all sessions, programmes and a copy of abstract, refreshments, lunch, dinner and also a full set of conference proceedings.
Category Indian Delegates (in Rs.) Foreign Delegates (US$)
Delegates from academic institutions Rs. 1500/- US $400
Delegates from R & D Organisations/Industry Rs. 2000/- US $500
Research Scholars/ Students Rs.1250/- US $300
For each accepted paper to be published in proceedings, at least one of the authors has to register for participation. The registration fees should be paid by Demand Draft in favour of “The Principal, Velammal Engineering College, Chennai”, payable at Chennai.
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