2011 International Conference on Solid-State and Integrated Circuit 2nd round call for paper (ICSIC 2011)

Venue: Shanghai

Location: Shanghai, China

Event Date/Time: Mar 11, 2011 End Date/Time: Mar 13, 2011
Paper Submission Date: Dec 25, 2010
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2011 International Conference on Solid-State and Integrated Circuit (ICSIC 2011) will be held in Shanghai, China during March 11 - 13, 2011. ICSIC 2011 will bring together top researchers from Asian Pacific areas, North America, Europe and around the world to exchange research results and address open issues in all aspects of Solid-State and Integrated Circuit.

All accepted papers will be published in the conference proceeding by IEEE, and will be included in the IEEE Xplore, and indexed by the INSPEC, Thomson ISI (ISTP), and Ei Compendex.

Topics: The conference is soliciting state-of-the-art research papers in the following areas of interest:

(1) Silicon integrated circuits and manufacturing
(2) Digital, Analog, Mixed Signal IC and SOC design technology
(3) Low-power, RF devices & circuits
(4) IC Computer-Aided –Design technology, DFM
(5) Silicon/germanium devices and device physics
(6) Interconnect, Low K, High K and other process technologies
(7) Advance memories technology (Flash, FeRAM, PCM,ReRAM, MRAM etc.)
(8) Unconventional and nano-electronics
(9) Organic semiconductor devices and technologies
(10) Compound semiconductor devices and circuits
(11) Displays, sensors and MEMS
(12) Semiconductor materials and material characterization
(13) Reliability
(14) Modeling and simulation
(15) Packaging and testing technology
(16) Equipment technology
(17) Solar cell & other devices for new energy sources
(18) Others