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QUESTIONS2011 International Conference on Electronic Design Automation(ICEDA 2011) (ICEDA 2011)
Venue: Bangkok
| Event Date/Time: Dec 02, 2011 | End Date/Time: Dec 04, 2011 |
| Registration Date: Oct 30, 2011 | |
| Early Registration Date: Oct 30, 2011 | |
| Abstract Submission Date: Sep 30, 2011 | |
| Paper Submission Date: Sep 30, 2011 |
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Call for Papers
The call for papers for the 2011 International Conference on Electronic Design Automation (ICEDA 2011) is now available at the ICEDA 2011 Web site. Authors are invited to submit original technical papers describing recent and novel research or engineering developments in all areas of design automation tools and methodologies, silicon solutions and embedded system-on chip topics. As part of the regular program, ICEDA 2011 will feature a theme day on entertainment, games and multimedia. In addition, this year ICEDA 2011 is expanding the technical program in the areas of beyond-die integration and packaging, including chip-package co-design, system-in-package (SIP) and new integration techniques such as 3D and stacked designs, and new and emerging design technologies, such as nanotechnologies, quantum and biological computing and micro electro mechanical systems (MEMS).
Submitted conference papers will be reviewed by technical committees of the Conference. The ICEDA 2011 conference proceeding will proudly published by ASME Press, and will be included in ASME Digital Library, and indexed by EI Compendex, Thomson ISI Proceedings.
SUBMISSION METHODS:
1. Electronic Submission System; ( .pdf)
If you can't login the submission system, please try to submit through method 2.
2. Email: iceda@sie-edu.sg ( .pdf and .doc)
The call for papers for the 2011 International Conference on Electronic Design Automation (ICEDA 2011) is now available at the ICEDA 2011 Web site. Authors are invited to submit original technical papers describing recent and novel research or engineering developments in all areas of design automation tools and methodologies, silicon solutions and embedded system-on chip topics. As part of the regular program, ICEDA 2011 will feature a theme day on entertainment, games and multimedia. In addition, this year ICEDA 2011 is expanding the technical program in the areas of beyond-die integration and packaging, including chip-package co-design, system-in-package (SIP) and new integration techniques such as 3D and stacked designs, and new and emerging design technologies, such as nanotechnologies, quantum and biological computing and micro electro mechanical systems (MEMS).
Submitted conference papers will be reviewed by technical committees of the Conference. The ICEDA 2011 conference proceeding will proudly published by ASME Press, and will be included in ASME Digital Library, and indexed by EI Compendex, Thomson ISI Proceedings.
SUBMISSION METHODS:
1. Electronic Submission System; ( .pdf)
If you can't login the submission system, please try to submit through method 2.
2. Email: iceda@sie-edu.sg ( .pdf and .doc)
