China Semiconductor Technology International Conference (CSTIC 2012)

Venue: Kerry Hotel Pudong (The Shangri-la Group), Shanghai, China

Location: Shanghai, China

Event Date/Time: Mar 18, 2012 End Date/Time: Mar 19, 2012
Registration Date: Mar 19, 2012
Early Registration Date: Jan 30, 2012
Abstract Submission Date: Oct 30, 2011
Paper Submission Date: Dec 16, 2011
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Description

China Semiconductor Technology International Conference (CSTIC 2012)


Conference Date and Venue
March 18-19, 2012
Kerry Hotel Pudong (The Shangri-la Group), Shanghai, China

Important Deadlines
Abstract Deadline: October 30, 2011
Manuscript Deadline: December 16, 2011

Abstract Submission
http://semiconchina.semi.org/cstic

CSTIC is the largest annual industrial semiconductor technology conference in China. It is organized by SEMI and ECS, co-organized by China's High-Tech Expert Committee (CHTEC) and co-sponsored by IEEE, MRS and China Electronics Materials Industry Association. We are soliciting papers from around the world on all aspects of semiconductor technology and manufacturing. Original and overview papers from integrated device manufacturers (IDMs), materials suppliers and equipment vendors as well as academic and research institutes are particularly welcome. Prospective authors should submit a 200-500 words abstract and a brief bio to the conference Call for Papers site by October 30, 2011. The abstract template is available on the conference website. The abstract submission website remains open until October 30, 2011.

CSTIC aims to provide an enabling platform for executives, managers, engineers and researchers to exchange the latest developments in semiconductor technology and manufacturing. It also offers opportunities for those who are interested in investing in the semiconductor industry in Asia, particularly in China.

The CSTIC 2012 will continue to be held in conjunction with SEMICON China in Shanghai--one of the fastest growing regions in semiconductor manufacturing in the world. We look forward to seeing you in Shanghai next spring.

Topics to be addressed at CSTIC 2012 include, but not limited to, the following:

Symposium I: Design and Device Engineering
Symposium II: Lithography and Patterning
Symposium III: Dry &Wet Etch and Cleaning
Symposium IV: Thin Film Technology
Symposium V: CMP and Post-CMP Cleaning
Symposium VI: Materials and Process Integration for Device and Interconnection
Symposium VII: Packaging and Assembly
Symposium VIII: Metrology, Reliability and Testing
Symposium IX: Emerging Semiconductor Technologies
Symposium X: Advances in MEMS and Sensor Technologies


Confirmed CSTIC 2012 plenary speakers:

Dr. Leo Esaki, Nobel Laureate and IBM Fellow
Dr. Kinam Kim, Samsung Fellow, President and CEO of Samsung Institute of Advanced Technology and formerly Sr. VP of R&D of Samsung, Korea
Dr. Luc Van den hove, President and CEO of IMEC, Belgium

Partial list of confirmed symposium keynote and invited speakers:

Symposium I: Design and Device Engineering

Chung Lam, IBM Research, USA
Doris Bruce, IBM Research, USA
Huiming Bu, IBM Research, USA
Simon Deleonibus, CEA Research, France
Alan C. Seabaugh, University of Notre Dame, USA
Fred Chen, ITRI, Taiwan, China
Jianfu Zhang, Liverpool John Moores University, England
Charles Cheung, NIST, USA

Symposium II: Lithography and Patterning

Vivek Singh, Intel Corporation, USA
Ralph Dammel, AZ Electronics Materials, USA
Donis Flagello, Nikon Research America, USA
Edmund Lam, The University of Hong Kong, China
Yiming Gu, SMIC, China
Soichi Inoue, Toshiba, Japan
Andres Erdmann, Fraunhofer Institute of Technology, Germany
Ken Wu, SMIC, China
George Barclay, Dow Chemical, USA
Yuri Granik, Mentor Graphics, USA
Benjmain Lin, Cymer Asia, Taiwan, China
Peter Cheang, ASML, Taiwan, China
Yayi Wei, GlobalFoundry, USA
Lei Wang, Huahong NEC, China
Skin Zhang/Manhua Shen, SMIC, China
Xuelong Shi, SMIC, China

Symposium III: Dry & Wet Etch and Cleaning

Gottlieb S. Oehrlein, University of Maryland, USA
Dennis Hess, Georgia Institute of Technology, USA
Vahid Vahedi, Lam Research, USA
Meihua Shen, Applied Materials, USA
Sebastian Engelmann, IBM Research, USA
Erwine Pargan, LTM-CNRS, France
Maxime Darnon, LTM-CNRS, France
George Totir, IBM Research, USA
Anthony Muscat, University of Arizona, USA
Twan Bearda, IMEC, Belgium
Sumiya Masahiro, Hitachi, Japan


Symposium IV: Thin Film Technology

Qikun Xue, Tsinghua University, China
Chia-Hong Jan, Intel, USA
Mikael Östling, KTH, Sweden
Roey Shaviv, Novellus, USA,
Beichao Zhang, SMIC, China
Peijun Ding, North Electronic, China
Haiying Fu, Novellus, USA

Symposium V: CMP and Post-CMP Cleaning

Ananth Naman, Cabot Microelectronics Corporation, USA
Cuong Tran, ATMI, USA
EngHoe Tan, SMIC, China
David Huang, Pall Corp., USA
Jin Lu, Micrcon, USA
Sidney Huey, Applied Materials, USA
Edwin Tseng, NexPlanar, USA
Ken Chao, Dow Electronics Materials, USA
Ken Cadien, University of Alberta, Canada
Laertis Economikos, IBM, USA

Symposium VI: Materials and Process Integration for Device and Interconnection

Qikun Xue, Tsinghua University, China
Chia-Hong Jan, Intel, USA
Paul Kohl, Georgia Institute of Technology, USA
Bich-Yen Nguyen, Soitec, USA
Larry Zhao, Intel, Belgium
Shili Zhang, Uppsala University, Sweden

Symposium VII: Packaging and Assembly

Subu Iyer, IBM, USA
Doug Yu, TSMC, Taiwan, China
Takayuki Ohba, University of Tokyo, Japan
Kuan-Neng Chen, National Chiao Tung University, Taiwan, China
Paul Enquist, Ziptronicx, USA
Paul Franzon, NC State University, USA
Paul Ho, University of Texas at Austin, USA
Yogendra Joshi , Georgia Institute of Technology, USA
Eren Kursun, IBM, USA
Ganesh Subbarayan, Purdue University, USA
Roy Yu, IBM Research, USA

Symposium VIII: Metrology, Reliability and Testing

Shawn Blanton, Carnegie Mellon University, USA
David G. Seiler, NIST, USA
Asen Asenov, University of Glasgow, UK
Qiang Xu, The Chinese University of Hong Kong, China
Yu Huang, Mentor Graphics, USA
Guido Groeseneken, Katholieke University Leuven - IMEC, Belgium
Yoshiyasu Ito, RIGAKU Corporation, Japan

Symposium IX: Emerging Semiconductor Technologies

Barbara De Salvo, CEA-LETI, France
Hsiang-Lan Lung, Macronix International Co. Ltd., USA

Symposium X: Advances in MEMS and Sensor Technologies

Benedetto Vigna, STMicro, Italy
Liwei Lin, University of California, Berkeley, USA
Hans Zappe, University of Freiburg, Germany
Herb Huang, SMIC, China
Ir. Liesbet Lagae, IMEC and Catholic University Leuven, Belgium
Rinus Tek Po Lee, SEMATECH, USA
Xinxin Li, Shanghai Institute of Microsystems, CAS, China
Zewen Liu, Tsinghua University, China
Miao Lu, Xiamen University, China
Gregory Nielson, Sandia National Lab, USA
Jean Philippe Pollizzi, CEA-LETI, France
Horst Theuss, Infineon Technologies, Germany
M. Juergen Wolf, Fraunhofer IZM, Germany
Alice Zhang, Peking University, China


CSTIC 2011, which was held in March, 2011 had over 390 paper submissions, 340 speakers, and more than 700 attendees. Among the 340 accepted papers, 28% papers were from the U.S.,
15% papers from Europe, 9% papers from Japan, 36% papers from China. The rest of papers were from other countries. Many of the papers were from leading fabs, equipment and materials companies like IBM, Intel, Toshiba, STMicro, IMEC, TSMC, Infineon, ASE, Flextronics, ARM, SMIC, Applied Materials, TEL, KLA-Tencor and Dow Chemicals Company.

Dr. David Wang, CEO and President of Semiconductor Manufacturing International Inc. (SMIC),
Dr. T.C. Chen, IBM Fellow and Vice President of Science and Technology, Prof. Chenming Hu, TSMC distinguished chair professor of microelectronics at the University of California at Berkeley,
and Dr. John Lau, ITRI Fellow in Taiwan delivered the keynote speeches at the conference plenary session. Over 130 other world’s leading experts in semiconductor technology presented invited talks in the ten parallel symposia.

Other past CSTIC plenary speakers include

CSTIC 2009
Dr. J. Georg Bednorz, Nobel Laureate and IBM Fellow, Switzerland
Dr. Robert Chau, Intel Senior Fellow, USA
Prof. Gilbert Declerck, CEO, IMEC, Belgium
Mr. Ray Roberge, CTO, Praxair Inc., USA

CSTIC 2010
Dr. Stuart Parkin, IBM Fellow, USA
Mr. Yan Borodovsky, Intel Senior Fellow, USA
Prof. T. P. Ma, Director of Yale Center for Microelectronics, Yale University, USA

Contact
For more conference information about CSTIC 2012, please visit http://semiconchina.semi.org/cstic or contact SEMI at cstic@semi.org.cn, or call 86.21.50270909*208.

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