2013 2nd International Conference on Pure and Applied Mathematics (ICPAM 2013)

Venue: Moscow

Location: Moscow, Russia

Event Date/Time: Jul 27, 2013
Paper Submission Date: Feb 01, 2013
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The 2013 2nd International Conference on Pure and Applied Mathematics (ICPAM 2013) will be held in Moscow, Russia, during July 27-28, 2013. ICPAM 2013 is sponsored by SCIence and Engineering Institute(SCIEI).

The ICPAM 2013 offers a track of quality R&D updates from key experts and provides an opportunity in bringing in the new techniques and horizons that will contribute to Pure and Applied Mathematics in the next few years. All submitted papers will be under peer review and accepted papers will be published in the conference proceeding. Both academia and industries are invited to present their papers dealing with state-of-art research and future developments.

ICPAM is an event that focuses on the state of the art technologies pertaining to Pure and Applied Mathematics. The applications of Pure and Applied Mathematics to such domains as astronomy, biology, education, geosciences, security and health care are among topics of relevance to ICPAM. It is a technical congregation where the latest theoretical and technological advances on Pure and Applied Mathematics are presented and discussed. We expect that the conference and its publications will be a trigger for further related research and technology improvements in this important subject. ICPAM promotes fundamental and applied research continuing advanced academic education and transfers knowledge between involved both sides of and the Pure and Applied Mathematics.

Original papers are solicited in subjects including, but not limited to the following:
applied partial differential equations
applied Mathematics and Approximation Theory in the broad sense
computational physics
mathematical biology
image processing

All accepted papers of ICPAM 2013 will be published into International Journal of Applied Physics and Mathematics (ISSN: 2010-362X,DOI: 10.7763/IJAPM),which will be Indexed by: Engineering & Technology Digital Library, Nanowerk Database, Crossref and Google Scholar and CrossRef.